적용분야

특징 및 장점 (ADVANTAGES)

기술 사양 (SPECIFICATIONS)

X-ray 22 megapixel CCD camera

X-ray 32 megapixel CCD camera

· 4008 (h) x 5344 (v) CCD array

· 9744 (h) x 3248 (v) CCD array

· Input pixel size: 31.18 x 31.18 microns

· Input pixel size: 25.63 x 25.63 microns

· 124.96 x 166.14 mm (tiled array)

· 250 x 83.07 mm (slot array)

· 1.8 fps at full resolution @ 20 MHz

· 1.1 fps at full resolution @ 2x20 MHz

· 5 fps in binning 4x4 @ 1002 x 1336 resolution

· 3 fps in binning 4x4 @ 2436 x 812 resolution

· Readout noise : 14-18 electrons @ 20 MHz

  with interpolation noise reduction

· Readout noise: 12-16 electrons @ 2x20 MHz

  with interpolation noise reduction

· Full well capacity : 45,000 electrons in binning

  1x1; 90,000 electrons in binning 2x2

· Full well capacity : 25,000 electrons in binning

  1x1 - 50,000 electrons in binning 2x2

· Dark current : < 0,05 electrons / pixel /

  second isation / control : via TTL pulse or

  pixel clock

· Dark current : 0,05 electrons / pixel / second

· 12-bit digitisation

· 12-bit digitisation

· 16-bit extended dynamic range

· 16-bit extended dynamic range

· GdOS:Tb scintillator for operation from 5-55 keV  with minimum feature recognition of 10lp/mm :  typically 50 microns.

· Camera link / GigE interface

· CsI:Tl structured scintillator for operation from

  30-100 keV

· Synchronisation / control : via TTL pulse or

  pixel clock

· Camera link / GigE interface

· Synchron

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